Self-developed wafer

Independently developed 650V-3300V silicon carbide diode wafers and 650V/900V/1200V/1700V silicon carbide MOSFET wafers, have been widely used in new energy vehicles, charging piles, data centers, photovoltaics, energy storage and other fields.

Power Devices

We can provide discretes packaging services, provide dynamic and static electrical performance testing, thermal performance testing and reliability testing of the device, and issue device performance reports required by customers.

Double-Sided Cooling (DSC) TOLL package device

PCsemic launches the industry's first double-sided cooling TOLL package device with patent protection, can be used in BMS, motor drive, communication power supply and other fields. This device realizes the pin-to-pin replacement of traditional TOLL packaged devices, solves the pain point of insufficient thermal design of devices packaged with surface mounted technology (SMT) , and provides a better choice for high-power density integrated design of systems.

SIC Driver

The plug-and-play driver is a complete SiC driver that is strictly adapted to the corresponding device. The driver covers a variety of high-power and high-voltage SiC modules, and also provides customized driver services to adapt to power modules in different packages. All driver products have integrated isolated DC/DC power supply, short circuit protection, undervoltage lockout, active clamping and other functions.