Bonding Capability: Coarse Aluminum Wire Bonding, Coarse Copper Wire Bonding, Gold Wire Bonding, Clip Bond. Soldering Capability: Solder Paste Process, Solder Lug Process, Nano Silver Sintering Process, Nano Copper Sintering Process, DTS Process. Packaging: Customized according to customer's requirement. Applicable chips: Si/SiC MOSFET, IGBT, FRD and SBD, etc.