From July 8 to 10, 2024, electronica China grandly opened at the Shanghai New International Expo Center (SNIEC). The exhibition area is about 100,000 square meters, and there are more than 1,600 exhibitors. As an important event in the domestic and even Asian electronics industry, after more than 20 years of development, the electronica China has become a lighthouse exhibition in the industry.
At this exhibition, Chongqing Pingchuang Institute of Semiconductors Co., Ltd. (hereinafter referred to as "Pingchuang") focused on application fields such as new energy vehicles, high-end white goods, charging piles, photovoltaics, and energy storage. It mainly displayed products and solutions such as pressure-sintered copper paste, SiC MOSFET/SBD wafers/devices, SiC boost modules, SGT MOS, IGBT power modules, SiC/IGBT drivers, and FRD modules. Pingchuang’s booth was extremely popular. Let's take a look at the grand occasion of the exhibition!
Pingchuang debuted many new products at the electronica China. These products not only represent the company's latest research and development achievements but also showcase the company's technical strength in various links such as chip design, manufacturing, packaging and testing.
● Pressure-sintered copper paste
Pingchuang has made breakthroughs in copper powder antioxidant process innovation and slurry system innovation, and successfully developed the seCure-BC1113 chip-level pressure-sintered copper paste. This product has strong oxidation resistance, and the process window period can be as long as 24 hours without affecting product performance. Its sintering process is completely the same as that of Nano Silver sintering, and the sintering strength is at the same level as that of sintered silver.
● Double-sided heat dissipation packaged TOLL device
● The product adds a top heat dissipation path, greatly improving the heat dissipation capacity and is expected to reduce the number of parallel use of devices.
● The on-state resistance of the device is reduced and the current-carrying capacity is increased.
● It is sintered with high-temperature solder paste, and the top supports a secondary sintering heat dissipation device.
● New and core products
650/1200/1700V SiC SBD/MOSFET wafers and devices, six-channel high-voltage IGBT driver, dual-channel isolated driver chip, SiC MOSFET module, etc.
Pingchuang is deeply engaged in the power electronics semiconductor industry. Since its establishment, it has successively established an internationally advanced power chip/module design and research platform, an advanced power device research and development platform, an advanced automated packaging and testing production line, a high-level product reliability laboratory and a working condition simulation laboratory (which can realize product performance and static and dynamic testing, working condition simulation testing, etc.). Through long-term strategic agreements, it has a stable foundry platform.
In the future, Pingchuang will always maintain its passion for the semiconductor business and closely focus on the development in the field of power semiconductor technology. It will develop a world-leading core technology system through open innovation. "All for the customers." We will use excellent products, advanced technologies and all-round services to establish the vision of providing customers with a package of solutions, and are determined to grow into a world-leading provider of power semiconductor devices and innovative solutions!
